involves making a 'slice' through a sample.
Once all other examinations have been completed, a sample
is encased in a mounting medium, such as bakelite or epoxy. Once completely cured, the sample can then be ground down
to a flat surface and polished.
This type of analysis has various applications, such as:
- Identifying the microstructure of a sample
- Determining plating thickness
- Failure analysis
We also have
the capabilities of doing high precision cross sections through silicon die.
This type of cross-sectioning
allows for visual inspections of diffusion depths and other aspects of the individual die.
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