SEMTEC Laboratories, Inc.

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Cross-sectioning involves making a 'slice' through a sample.  

Once all other examinations have been completed, a sample is encased in a mounting medium, such as bakelite or epoxy.  Once completely cured, the sample can then be ground down to a flat surface and polished.  

This type of analysis has various applications, such as:

  • Identifying the microstructure of a sample
  • Determining plating thickness
  • Failure analysis

We also have the capabilities of doing high precision cross sections through silicon die.  

This type of cross-sectioning allows for visual inspections of diffusion depths and other aspects of the individual die.

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SEMTEC Laboratories, Inc. - 5025 S. 33rd Street - Phoenix, AZ 85040
An ISO 9001 Company
Phone: (602) 276-6138   Fax: (602)232-2225